Fraunhofer Center for Assistive Information and Communication Solutions – AICOS10.3.2017
The Internet of Things in Package (IoTiP) project was highlighted on the Internet of Nano Things (IoNT) workshop. “Wafer-level modular architecture for IoT” was the topic presented by the researchers of Fraunhofer Portugal AICOS and NANIUM S.A., the two partners of the project. The IoNT workshop occurred on March 7th and 8th, in the INL - International Iberian Nanotechnology Laboratory, in Braga.
The connection between nano devices is now a reality. Through the Internet of Nano Things (IoNT), nanosensors and nanotechnology-enabled devices can be connected into communication networks, taking the Internet of Things (IoT) to new markets that now can benefit from this technology.
To bring together the scientific and technological community was the purpose of the IoNT workshop, where potential collaboration opportunities were discussed. The initiative received representatives from industry and academia especially from the North of Portugal and from Lund, in Sweden.
The sessions were divided into two main topics, as “Nano-enabled sensors of the future” and “System-on-Silicon nanotechnologies”. The IoTiP project was presented under the second topic, by Manuel Monteiro, from Fraunhofer Portugal AICOS, and by Rui Pedro Silva, from NANIUM S.A.
The workshop was organized by the International Iberian Nanotechnology Laboratory (INL) and the Mobile Heights and Materials Business Center, with the cooperation of the University of Minho, the Centre for Nanotechnology and Smart Materials (CeNTI) and the InvestBraga.
The project Internet of Things in Package is co-funded by the European Regional Development Fund (ERDF) under COMPETE 2020.