Fraunhofer Center for Assistive Information and Communication Solutions – AICOS
Internet of things in Package: Wafer Level Modular Architecture for Internet of Things
Description:
Over the last few years we have seen the integration of sensor technology, processing power and radio connectivity in the objects that surround us in our daily life, corresponding to the emerging Internet of Things (IoT). Despite the increasing number of smart devices there are still some challenges that have a negative impact in the sustainability and dissemination of the IoT. One of the most concerning challenges is the time and costs associated with hardware development. Having this in mind, IoTiP addresses these problems by presenting a development platform that will contribute for the spread of the IoT concept. IoTiP’s platform combines hardware, firmware and software components to build a development ecosystem for the IoT. This will contribute to the simplification and speeding-up of the development of new IoT solutions, thus contributing for a more advanced technology addressing new markets and requirements.
Furthermore, IoTiP will also address technical related issues, such as miniaturization, reduction of energy consumption, integration with other systems or the access to higher levels of information.
The proposed ecosystem is built on the top of a new System-in-Package (SiP) that embeds sensing, processing, energy management and radio communications. This chip will also provide a physical interface to enable a modular architecture for adding new features that can be of practical use in a huge variety of applications. Moreover, IoTiP’s ecosystem will provide a hardware abstraction layer that will allow developers to seamlessly interact with the SiP and its features in order to reduce even further the development cycle. In the scope of the project it is also proposed the development of a web platform to provide the specifications, documentation, and examples to develop solutions based on IoTiP’s ecosystem.
Not only is the project goal to offer a development platform that stimulates the creation of new IoT solutions, but also to enable former low-tech industries, such as footwear or textile industries, to embed technology in their solutions yielding a differentiated product.
Partner:
ATEP – Amkor Technology Portugal, SA (coordinator).
Outcome:
Development ecosystem for the Internet of Things that includes:
> A novel miniaturized and modular SiP architecture;
> An abstraction layer featuring seamless access to hardware core functions and optimized algorithms for information extraction;
> A web portal to present the ecosystem, features, documentation and examples;
> An example application developed based on IoTiP’s ecosystem to demonstrate its potential and main advantages.
Consult the project's Spec Sheet here:
Co-funded by:
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